Kev lag luam hluav taws xob hauv ntiaj teb tab sis siv cov txheej txheem sib txuas, thiab kev ua haujlwm sib tw, thiab kev sib tw tau rov ua cov tswv yim kom sib npaug nrog resilience .
Cov Khoom Siv Hluav Taws Xob Hauv Nroog Txais Nyiaj Txiag
Geopolitical cov nro thiab kev cuam tshuam-kev cuam tshuam-kev cuam tshuam kom nrawm rau cov haujlwm hauv cheeb tsam . Cov qhab nia zoo xws li:
Cov thawj kauj ruam ze: North American thiab European cov tseem fwv hauv zos zoo li MLCCS (multilayer cericascitors) thiab lub zog samiconductors .
Cov lus nug Buffering: Cov neeg faib khoom tam sim no tswj hwm 20-30% cov qib kev nyab xeeb ntau dua rau cov khoom muaj kev pheej hmoo xws li microconstrollers thiab RF txuas thiab RF txuas.}
Dual-Sourcing Cov Txheej Txheem: Automotive tier 1 cov neeg muab khoom kom muaj cov lus pom zoo dua ob zaug rau kev txo hwj chim rau kev txo cov chaw nyob hauv qhov kev pheej hmoo ntawm.
Cov kev ntsuas no taw los txo cov sijhawm coj txhuas los ntawm {} pisis los ruaj khov 12 - {}}}2025.
Tawg nyob rau hauv cov ntaub ntawv semiconductor
Cov ntaub ntawv tom ntej yog hais txog kev ua tau zoo bottlenecks hauv cov kev siv hluav taws xob siab thiab muaj hluav taws xob siab:
Gallium Nitride (Gan) kev saws me nyuam: Lub zog electronics Kev ua tiav Gan tau ua tiav 98% kev ua tau zoo ntawm 40% tiv thaiv cov kev daws teeb meem silicon-raws li cov ntsiab lus silicon-raws li kev daws teeb meem.
Silicon Carbide (Sic) Scaling: 200mm SIC Wafer Ntau Lawm, txiav hluav taws xob module nqi los ntawm 18% txhua xyoo dhau los ntawm2027.
Organic substrates: Tsis muaj zog polymer kom muaj 5g npias kav hlau txais xov-hauv-pob tsim nrog 30% me dua hneev nti.
Kev ruaj khov los ua cov qauv tsim
Kev cai tswj xyuas nias thiab esg kev lag luam xav tau kho cov khoom lag luam tiv thaiv:
Lead-Free Soldering: Revised iec 61191-3 Txheem Thawb Rofow Profiles kom haum rau Bisnag Alloys.
Siv Cov Ntim Uas Tau Rov Siv: Debically Debondable Epoxy pwm tso cai 95% cov ntaub ntawv rov qab los ntawm cov PCB discarded {}}
Carbon-nruab nrab lawm: Cov thawj coj ua tiav tau ua tiav 3 emissions txo cov tshuaj Ai-optimized tshuaj vapor deposition.
Cov Ntawv Thov Roj Kev Xav Tau
1. ntug AI Hardware
Cov khoom ua kom zoo-ultra-muaj hluav taws xob mcus thiab ntug tpus-pab cov ntaub ntawv onboard
2. Kev Siv Tsheb Hluav Taws Xob
Lub zog hluav taws xob pov hwm yuav tsum tau 3 × ntau dua igbt ntau dua cov tsheb dej khov, spurring $ 12 teev cov khoom siv hauv tsheb qib hauv kev kawm qib ib xyoos
{{0 {}} Quantum xam Interfaces
Cryogenic-muaj peev xwm sib tshuam thiab ultra-ruaj khov oscillators tawm raws li cov enterters rau kev tswj cov hlab {}}
Cov kev sib tw hauv kev sib cav ntawm cov tawv
Thaum 3nm thiab 2nm chips nkag ntau ntau lawm, bottenks tsis tu ncua:
EUV Lithography Constrains: ASML's BRAPP LUAG LIN txhua hli EUV Wafer tawm ntawm 160, {}}}}} kev lag luam {}}
Kev Tswj Cov Thermal: 5D ntim cov ntsiab lus yuav tsum tau nanofluidic cua txias daws rau dissipate 1kW / cm² kub ceev rau.
Txuj Ci Tsis Txaus: Lub sector ntsib ib tug projected defficit ntawm 300, {}}} Cov kws tshaj lij engineers los ntawm 2030, ib semi qhia {}}
Kev Ua Lag Luam Outlook thiab Cov Yeeb Yam Lawm
Cov kws tshuaj ntsuam xyuas cov khoom siv hluav taws xob hluav taws xob tiv thaiv hluav taws xob kom loj hlob ntawm 6.8% CGN txog 2030, Fueled los ntawm:
Iot proliferation: 75 rho tawm cov khoom siv txuas nrog cov miniaturized thiab cov tshuab sau hluav taws xob .
Kev Muaj Cov Dagitalization: Kev twv xyuas cov tshuab tsav tsheb mus xav tau rau kev ua kev co-resistant txuas txuas thiab kev lag luam Mems .
Tsoom fwv semiconductor Cov Cai: $ 52B hauv u . s} s} s} Txoj Cai EU Chips ANStating R & D {4 4}}