1. Vim li cas cov txheej txheem txiav coil yog BMS cov neeg saib xyuas ntsiag to
Nyob rau hauv cov roj teeb tswj cov tshuab (BMS), ua rau chev tsheb ua peb lub neej-lossis-tuag ua haujlwm:
Kev Rho Npe Kos Npe: Kev xa cov voltage \/ cov ntaub ntawv kub hla cov hluav taws xob siab
Lub Zog Hloov Hloov: Ua kom DCDC ib lub zog hluav taws xob thaum pib
Kev Saib Xyuas Kev Nyab Xeeb: Tshawb nrhiav rwb thaiv tsev ua tsis tau thaum lub sijhawm
Ua tsis tiav pov tseg kev puas tsuaj loj:
Qhib-Circuit Kev Ua Tsis tiav→ Socular Phaj Roj Teeb Kho Roj Teeb → Thermal Khiav Tawm (tawg kev pheej hmoo rau NMC roj teeb)
Rwb Thaiv Tsev Laus → Leakage current >10ma → hluav taws xob muaj kev phom sij (ua txhaum GB \/ T 31485)
2. Cov hauv paus ua rau: cov khoom siv, cov txheej txheem, ib puag ncig
Cov khoom siv cov khoom txwv
Enamel wire breakdown >150 Qib (polyesterimide Carbonancy)
Silicon steel core eddy losses spike >100kHz (hauv zos overheating)
Txheej Txheem Tsis Txaus
Lub tshuab nqus khoom tsis tiav impregnation → Cua cua ci ntsa iab →
Cov pob qij txha txias cov pob qij txha ntawm koob → slactures hauv qab thermal cycling (CATL Kev Kawm Ntawv)
Kev nyuaj siab system
Battery pack ΔT >40 DEGree ← MICATIC DEATCHATION los ntawm CTE Mismatch
EMI surges >200A \/ μs thaum igbt hloov → core surmation
3. Kev tsim qauv: 4-} Pronged lub tswv yim
| Lus teb | Kev nqis | Ua rau |
|---|---|---|
| Cov Khoom Siv Tseem Ceeb | Nanocrystalline alloy (60% qis eddy poob vs Silicon hlau) | Txo cov nyiaj tau |
| Hlau Txawj | Qib 220 Polyamide-Imide Enamel (withstands 240 Qib) | Tiv thaiv kev ua pa |
| Kev txiav hlo | Laser Vuam hloov chaw yoj soldering | Pov Tseg Txias Pob Qij |
| Encapsulation | Epoxy + silica filler (thermal conductivity >1.5W \/ MK) | Txhim kho tshav kub dissipation |
Kev tiv thaiv Circuital:
Tseem ceeb ntxiv: Fuse txhua voltage siab txoj kab (AEM 1206-} series fuses)
PCB txheej txheem kev cai:
Yam tsawg kawg nkaus 15mm clearance los ntawm igbt modules
Av dav hlau slotting rau suppress eddy dej
4. Kev Siv Tau Tawm Tsam: Tshaj mus ntsuas kev ntsuas
Txhim kho txoj kev ntseeg tau
| Xeem ntawv | Lub hom phiaj | Hloov kho raws tu qauv |
|---|---|---|
| Kev caij tsheb kauj vab thermal | GB \/ T 28046.4 | {{0 {0}} degree ↔125 degree, 500 txog 500) |
| Random regrited | Iso 16750-3 | PSD nce ntxiv rau 50gmms |
| H3trb vaum bias | AEC-Q200 | Txuas ntxiv rau 1000h (yog 500h) |
Dongfeng lub cev muaj zog patentle
Cov Khoom Siv Kho Vajtse Txiav Nyiaj Them Nqi tsis pub dhau 50ms thaum COIL tsis ua haujlwm BMS software nkaus 7.Daim ntawv thov tau: Prevents thermal runaway when SOC >95% nrog BMS ua txhaum.
5. Kev ua txhaum-qib kev ua txhaum kev zam
Kev Tiv Thaiv Thib Ob
Uchihashi fv-seriesHybrid Protector:
Ua ke fuse fuse + resistor + PTC
Mus ncig ntawm overcurrent \/ Overvoltage \/ Overtemperature ib txhij
800a breaking muaj peev xwm (siv tau rau NMC roj teeb)
Kev Txij Nkawm Txij Nkawm
Coil lifespan qauvNtawm Arrhenius sib npaug (txhua 10 degree poob ob npaug nyiaj)
Dynamic threshold: Trigger alert when impedance drift >15%
6. Xa Ntawv Xaiv Xaiv
Yuav tsum tau muab sau tseg: Iaf 16949 + AEC-Q200 Rev-E
Cov Ntaub Ntawv Transparency: Tas Nrho Ntse Cov Curves Tam Sim No (-40 degree ~ 150 degree) yuav tsum tau
Innovation Pipeline: Asic-artnated coils (txo cov ntsiab lus tsis ua haujlwm los ntawm 70%)
Tiag tiag-ntiaj teb cuam tshuam: Nanocrystalline cores txo cov teb tsis ua tiav los ntawm 83% hauv 2024 los ntawm 2024 byd hniav roj teeb pob.